Provides high quality sound with minimal loss of audio fidelity.
BIOSTAR Hi-Fi Ground ( Golden Line ) is noise-blocking multi-layer PCB design to isolates analog audio signals from digital sources. Unique PCB layout is ideal for exceptional clarity and high fidelity sound.
The new 4K2K resolution enables high-definition image display with four times the resolution of full HD ,4K2K display is faithfully express bright, highly detailed content that fills the entire screen with lifelike images. Connectivity with PCs via a single HDMI cable for displaying 4K2K data.
DirectX 12 introduces the next version of Direct3D, the graphics API at the heart of DirectX. Direct3D is one of the most critical pieces of a game or game engine, and we’ve redesigned it to be faster and more efficient than ever before. Direct3D 12 enables richer scenes, more objects, and full utilization of modern GPU hardware.
Integrated HDMI with HDCP
Onboard HDMI connector allows full video & audio support. It has industry-leading high definition video quality.
USB 3.1 Gen 1 Type-A
Experience Fastest data transfers at 5 Gbps with USB 3.1 Gen 1–the new latest connectivity standard. Built to connect easily with next-generation components and peripherals, USB 3.1 Gen 1 transfers data 10X faster and backward compatible with previous USB 2.0 components
PCI-e M.2 32Gb/s
PCI-e M.2 32Gb/s is the latest storage interface, it delivers the highest bandwidth and lower latency. It’s 3 times faster compared with PCI-e M.2 10Gb/s.
PCI-E Gen 3.0
PCI-E 3.0 is the next evolution of the ubiquitous and general-purpose PCI Express I/O standard. At 8GT/s bit rate, the interconnect performance bandwidth is doubled over PCI-E 2.0, while preserving compatibility with software and mechanical interfaces.
STAIII 6Gbps provides a higher bandwidth to retrieve and transfer HD media. With this super speed data transfer, SATAIII allows an incredible data boost which is 2x faster than the SATA 3G.
The primary advantages of DDR4 over DDR3, include higher module density, lower voltage requirements, coupled with higher data transfer rate.
The popularity of PC usage and working environment is getting deteriorating and moist(rural, coastal, etc.). The PCB will be oxidizing easily by damp or absorbed moisture, and ionic migration or CAF (Conductive Anodic Filament) will be generated. Moisture-proof PCB meets high density and high reliability requirements for moisture proof.